Kosuke WADA

Person

  • Omuta-shi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Heat-conductive resin composition and heat dissipation sheet

    • Patent number 12,305,113
    • Issue date May 20, 2025
    • DENKA COMPANY LIMITED
    • Kosuke Wada
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Ceramic circuit board

    • Patent number 10,424,529
    • Issue date Sep 24, 2019
    • DENKA COMPANY LIMITED
    • Ryota Aono
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents