Kosuke WADA

Person

Omuta-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic circuit board
- Patent number 10,424,529
- Issue date Sep 24, 2019
- DENKA COMPANY LIMITED
- Ryota Aono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
AGGREGATED BORON NITRIDE PARTICLES, BORON NITRIDE POWDER, HEAT-COND...
- Publication number 20240052226
- Publication date Feb 15, 2024
- DENKA COMPANY LIMITED
- Kosuke WADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT DISSIPATION SHEET AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET
- Publication number 20240043730
- Publication date Feb 8, 2024
- DENKA COMPANY LIMITED
- Kosuke WADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BORON NITRIDE POWDER, HEAT DISSIPATION SHEET, AND METHOD FOR PRODUC...
- Publication number 20240026198
- Publication date Jan 25, 2024
- DENKA COMPANY LIMITED
- Kosuke WADA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
HEAT DISSIPATION SHEET
- Publication number 20230220262
- Publication date Jul 13, 2023
- DENKA COMPANY LIMITED
- Kosuke WADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CONDUCTIVE RESIN COMPOSITION AND HEAT DISSIPATION SHEET
- Publication number 20230220263
- Publication date Jul 13, 2023
- DENKA COMPANY LIMITED
- Kosuke WADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATIO...
- Publication number 20230052370
- Publication date Feb 16, 2023
- DENKA COMPANY LIMITED
- Kosuke WADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET LAYERED BODY, STRUCT...
- Publication number 20220392824
- Publication date Dec 8, 2022
- DENKA COMPANY LIMITED
- Kosuke WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SHEET
- Publication number 20220346280
- Publication date Oct 27, 2022
- DENKA COMPANY LIMITED
- Kosuke WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-DISSIPATING SHEET
- Publication number 20220344242
- Publication date Oct 27, 2022
- DENKA COMPANY LIMITED
- Kosuke WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DIFFUSION SHEET AND METHOD OF PRODUCING HEAT-DIFFUSION SHEET
- Publication number 20220278020
- Publication date Sep 1, 2022
- DENKA COMPANY LIMITED
- Kosuke WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD
- Publication number 20160358840
- Publication date Dec 8, 2016
- DENKA COMPANY LIMITED
- Ryota AONO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Kosuke WADA

Person

Patents Grantslast 30 patents

Ceramic circuit board

Patents Applicationslast 30 patents

AGGREGATED BORON NITRIDE PARTICLES, BORON NITRIDE POWDER, HEAT-COND...

HEAT DISSIPATION SHEET AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET

BORON NITRIDE POWDER, HEAT DISSIPATION SHEET, AND METHOD FOR PRODUC...

HEAT DISSIPATION SHEET

HEAT-CONDUCTIVE RESIN COMPOSITION AND HEAT DISSIPATION SHEET

HEAT DISSIPATION SHEET AND METHOD FOR MANUFACTURING HEAT DISSIPATIO...

HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET LAYERED BODY, STRUCT...

HEAT DISSIPATION SHEET

HEAT-DISSIPATING SHEET

HEAT-DIFFUSION SHEET AND METHOD OF PRODUCING HEAT-DIFFUSION SHEET

CERAMIC CIRCUIT BOARD