Kosuke YAMASHITA

Person

Shizuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for thermal conductive layer, manufacturing me...
- Patent number 11,848,249
- Issue date Dec 19, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal conductive layer, photosensitive layer, photosensitive comp...
- Patent number 11,697,754
- Issue date Jul 11, 2023
- FUJIFILM Corporation
- Kosuke Yamashita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structure, method for manufacturing structure, laminate, and semico...
- Patent number 11,355,439
- Issue date Jun 7, 2022
- FUJIFILM Corporation
- Kosuke Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive bonding member, semiconductor device, semico...
- Patent number 10,559,548
- Issue date Feb 11, 2020
- FUJIFILM Corporation
- Kosuke Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive member and multilayer wiring substrate
- Patent number 9,899,306
- Issue date Feb 20, 2018
- FUJIFILM Corporation
- Yoshinori Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure, multilayer wiring board, semiconductor package and...
- Patent number 9,799,594
- Issue date Oct 24, 2017
- FUJIFILM Corporation
- Kosuke Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD FOR THERMAL CONDUCTIVE LAYER, MANUFACTURING ME...
- Publication number 20220216126
- Publication date Jul 7, 2022
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE LAYER, PHOTOSENSITIVE LAYER, PHOTOSENSITIVE COMP...
- Publication number 20210040370
- Publication date Feb 11, 2021
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, LAMINATE, AND SEMICO...
- Publication number 20200168551
- Publication date May 28, 2020
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE BONDING MEMBER, SEMICONDUCTOR DEVICE, SEMICO...
- Publication number 20180350769
- Publication date Dec 6, 2018
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE MEMBER AND MULTILAYER WIRING SUBSTRATE
- Publication number 20170125330
- Publication date May 4, 2017
- FUJIFILM CORPORATION
- Yoshinori HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRUCTURE, MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND...
- Publication number 20160336262
- Publication date Nov 17, 2016
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE
- Publication number 20160153104
- Publication date Jun 2, 2016
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-LAYERED BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20140085829
- Publication date Mar 27, 2014
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPICALLY CONDUCTIVE MEMBER
- Publication number 20120073973
- Publication date Mar 29, 2012
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROSTRUCTURE AND MICROSTRUCTURE PRODUCTION METHOD
- Publication number 20110311800
- Publication date Dec 22, 2011
- FUJIFILM CORPORATION
- Kosuke YAMASHITA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kosuke YAMASHITA

Person

Patents Grantslast 30 patents

Manufacturing method for thermal conductive layer, manufacturing me...

Thermal conductive layer, photosensitive layer, photosensitive comp...

Structure, method for manufacturing structure, laminate, and semico...

Anisotropic conductive bonding member, semiconductor device, semico...

Anisotropic conductive member and multilayer wiring substrate

Microstructure, multilayer wiring board, semiconductor package and...

Patents Applicationslast 30 patents

MANUFACTURING METHOD FOR THERMAL CONDUCTIVE LAYER, MANUFACTURING ME...

THERMAL CONDUCTIVE LAYER, PHOTOSENSITIVE LAYER, PHOTOSENSITIVE COMP...

STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, LAMINATE, AND SEMICO...

ANISOTROPIC CONDUCTIVE BONDING MEMBER, SEMICONDUCTOR DEVICE, SEMICO...

ANISOTROPIC CONDUCTIVE MEMBER AND MULTILAYER WIRING SUBSTRATE

MICROSTRUCTURE, MULTILAYER WIRING BOARD, SEMICONDUCTOR PACKAGE AND...

METHOD FOR MANUFACTURING METAL-FILLED MICROSTRUCTURE

MULTI-LAYERED BOARD AND SEMICONDUCTOR PACKAGE

ANISOTROPICALLY CONDUCTIVE MEMBER

MICROSTRUCTURE AND MICROSTRUCTURE PRODUCTION METHOD