Kota NODA

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wiring board with conductive post
- Patent number 10,221,497
- Issue date Mar 5, 2019
- Ibiden Co., Ltd.
- Kota Noda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,930,791
- Issue date Mar 27, 2018
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,917,025
- Issue date Mar 13, 2018
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and circuit substrate
- Patent number 9,837,345
- Issue date Dec 5, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,793,200
- Issue date Oct 17, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board with built-in electronic component and method for manu...
- Patent number 9,743,534
- Issue date Aug 22, 2017
- Ibiden Co., Ltd.
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,723,729
- Issue date Aug 1, 2017
- Ibiden Co., Ltd.
- Takeshi Furusawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,704,795
- Issue date Jul 11, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,699,920
- Issue date Jul 4, 2017
- Ibiden Co., Ltd.
- Kota Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,538,651
- Issue date Jan 3, 2017
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for mounting semiconductor element
- Patent number 9,374,903
- Issue date Jun 21, 2016
- Ibiden Co., Ltd.
- Naoki Katsuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,925,192
- Issue date Jan 6, 2015
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit board and manufacturing method thereof
- Patent number 8,766,106
- Issue date Jul 1, 2014
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,698,009
- Issue date Apr 15, 2014
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing double-sided circuit board
- Patent number 8,413,324
- Issue date Apr 9, 2013
- Ibiden Co., Ltd.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER AND CIRCUIT SUBSTRATE
- Publication number 20170018494
- Publication date Jan 19, 2017
- IBIDEN CO., LTD.
- Kota NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160120033
- Publication date Apr 28, 2016
- IBIDEN CO., LTD.
- Takeshi FURUSAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160113110
- Publication date Apr 21, 2016
- IBIDEN CO., LTD.
- Takeshi FURUSAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105957
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160105966
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160043027
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160044780
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150366061
- Publication date Dec 17, 2015
- IBIDEN CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150366062
- Publication date Dec 17, 2015
- IBIDEN CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST
- Publication number 20150271929
- Publication date Sep 24, 2015
- IBIDEN CO., LTD.
- Kota NODA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150223338
- Publication date Aug 6, 2015
- IBIDEN CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150008021
- Publication date Jan 8, 2015
- IBIDEN CO., LTD.
- Naoto Ishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140353017
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Kota NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT
- Publication number 20140262447
- Publication date Sep 18, 2014
- IBIDEN CO., LTD.
- Naoki KATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120186868
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Kota Noda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120181076
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100307809
- Publication date Dec 9, 2010
- IBIDEN, CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20100307807
- Publication date Dec 9, 2010
- IBIDEN CO., LTD.
- Kota NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Method for manufacturing wiring board with conductive post

Wiring board with built-in electronic component and method for manu...

Printed wiring board and method for manufacturing printed wiring board

Interposer and circuit substrate

Printed wiring board

Wiring board with built-in electronic component and method for manu...

Printed wiring board

Printed wiring board and method for manufacturing the same

Printed wiring board

Printed wiring board and method for manufacturing the same

Multilayer printed wiring board for mounting semiconductor element

Printed wiring board and method for manufacturing the same

Double-sided circuit board and manufacturing method thereof

Printed wiring board and method for manufacturing the same

Method of manufacturing double-sided circuit board

Patents Applicationslast 30 patents

INTERPOSER AND CIRCUIT SUBSTRATE

PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE POST

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

DOUBLE-SIDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF