Kou-Ning Chiang

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
3D electronic packaging structure having a conductive support subst...
- Patent number 7,884,464
- Issue date Feb 8, 2011
- Advanced Chip Engineering Technologies Inc.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMAN...
- Publication number 20080142941
- Publication date Jun 19, 2008
- Advanced Chip Engineering Technology Inc.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D electronic packaging structure having a conductive support subst...
- Publication number 20070296065
- Publication date Dec 27, 2007
- Advanced Chip Engineering Technology Inc.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS