Kou Onodera

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and plating method
- Patent number 7,811,440
- Issue date Oct 12, 2010
- TDK Corporation
- Kou Onodera
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pulling-down apparatus and container therefor
- Patent number 7,323,053
- Issue date Jan 29, 2008
- TDK Corporation
- Kazushige Tohta
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Plating apparatus and plating method
- Publication number 20090045069
- Publication date Feb 19, 2009
- TDK Corporation
- Kou Onodera
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Pulling-down apparatus and container therefor
- Publication number 20060185580
- Publication date Aug 24, 2006
- TDK Corporation
- Kazushige Tohta
- C30 - CRYSTAL GROWTH