Kou Sasaki

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and system
- Patent number 8,723,301
- Issue date May 13, 2014
- Renesas Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and system
- Patent number 8,310,035
- Issue date Nov 13, 2012
- Renesas Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 8,310,066
- Issue date Nov 13, 2012
- Renesas Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package land grid array substrate and plurality of fi...
- Patent number 7,952,186
- Issue date May 31, 2011
- Renesas Electronics Corporation
- Kou Sasaki
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including mounting board with stitches and fir...
- Patent number 7,944,036
- Issue date May 17, 2011
- Renesas Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package of stacked semiconductor chips with sp...
- Patent number 7,888,805
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample wafer fabrication method
- Patent number 7,867,884
- Issue date Jan 11, 2011
- Renesas Electronics Corporation
- Tomohiro Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 7,679,199
- Issue date Mar 16, 2010
- NEC Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package of stacked semiconductor chips with sp...
- Patent number 7,323,786
- Issue date Jan 29, 2008
- NEC Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND SYSTEM
- Publication number 20130037928
- Publication date Feb 14, 2013
- RENESAS ELECTRONICS CORPORATION
- Kou SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and system
- Publication number 20110108975
- Publication date May 12, 2011
- Renesas Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having electrostatic protection circuit for s...
- Publication number 20100103573
- Publication date Apr 29, 2010
- NEC ELECTRONICS CORPORATION
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus
- Publication number 20090057926
- Publication date Mar 5, 2009
- NEC Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus
- Publication number 20090057925
- Publication date Mar 5, 2009
- NEC ELECTRONICS CORPORATION
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAMPLE WAFER FABRICATION METHOD
- Publication number 20080261386
- Publication date Oct 23, 2008
- NEC ELECTRONICS CORPORATION
- Tomohiro Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080230888
- Publication date Sep 25, 2008
- NEC Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having projected substrate
- Publication number 20080231288
- Publication date Sep 25, 2008
- NEC Electronics Corporation
- Kou Sasaki
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE OF STACKED SEMICONDUCTOR CHIPS WITH SP...
- Publication number 20080087989
- Publication date Apr 17, 2008
- NEC ELECTRONICS CORPORATION
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package of stacked semiconductor chips
- Publication number 20050184378
- Publication date Aug 25, 2005
- NEC Electronics Corporation
- Kou Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and system

Semiconductor package and system

Semiconductor apparatus

Semiconductor package land grid array substrate and plurality of fi...

Semiconductor device including mounting board with stitches and fir...

Semiconductor device package of stacked semiconductor chips with sp...

Sample wafer fabrication method

Semiconductor apparatus

Semiconductor device package of stacked semiconductor chips with sp...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND SYSTEM

Semiconductor package and system

Semiconductor package having electrostatic protection circuit for s...

Semiconductor apparatus

Semiconductor apparatus

SAMPLE WAFER FABRICATION METHOD

Semiconductor device

Semiconductor package having projected substrate

SEMICONDUCTOR DEVICE PACKAGE OF STACKED SEMICONDUCTOR CHIPS WITH SP...

Semiconductor device package of stacked semiconductor chips