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Kou Shimomura
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Hyogo, JP
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last 30 patents
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Patent Grant
Semiconductor device and module
Patent number
5,592,019
Issue date
Jan 7, 1997
Mitsubishi Denki Kabushiki Kaisha
Tetsuya Ueda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Carrier tape
Patent number
5,196,917
Issue date
Mar 23, 1993
Mitsubishi Denki Kabushiki Kaisha
Tetsuya Ueda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing aluminum bonding pad with PSG coating
Patent number
4,824,801
Issue date
Apr 25, 1989
Mitsubishi Denki Kabushiki Kaisha
Hiroshi Kawashimo
H01 - BASIC ELECTRIC ELEMENTS