Kou Shimomura

Person

  • Hyogo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device and module

    • Patent number 5,592,019
    • Issue date Jan 7, 1997
    • Mitsubishi Denki Kabushiki Kaisha
    • Tetsuya Ueda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Carrier tape

    • Patent number 5,196,917
    • Issue date Mar 23, 1993
    • Mitsubishi Denki Kabushiki Kaisha
    • Tetsuya Ueda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of manufacturing aluminum bonding pad with PSG coating

    • Patent number 4,824,801
    • Issue date Apr 25, 1989
    • Mitsubishi Denki Kabushiki Kaisha
    • Hiroshi Kawashimo
    • H01 - BASIC ELECTRIC ELEMENTS