Kou Shimomura

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Itami, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor sealing epoxy resin composition
- Patent number 5,034,436
- Issue date Jul 23, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Ichiro Takahashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...