Kouhei Enchi

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Osaka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer circuit board
- Patent number 7,423,884
- Issue date Sep 9, 2008
- Matsushita Electric Industrial Co., Ltd.
- Kouhei Enchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for applying sealant to IC having bumps
- Patent number 6,455,099
- Issue date Sep 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kouhei Enchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multilayer circuit board
- Publication number 20060081397
- Publication date Apr 20, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kouhei Enchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR