Kouhei Toyama

Person

  • Nishi-shirakawa-gun, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Wire saw apparatus

    • Patent number 5,907,988
    • Issue date Jun 1, 1999
    • Shin-Etsu Handotai Co., Ltd.
    • Etsuo Kiuchi
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Method for cutting a workpiece with a wire saw

    • Patent number 5,839,425
    • Issue date Nov 24, 1998
    • Shin-Etsu Handotai Co., Ltd.
    • Kouhei Toyama
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Wire saw

    • Patent number 5,715,807
    • Issue date Feb 10, 1998
    • Shin-Etsu Handotai Co., Ltd.
    • Kouhei Toyama
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Roller having grooves for wire saw

    • Patent number 5,575,189
    • Issue date Nov 19, 1996
    • Shin-Etsu Handotai Co., Ltd.
    • Etsuo Kiuchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR