Kouichi HASHIMOTO

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Niigata-shi, Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Heat sink, semiconductor package and semiconductor module
- Patent number 12,130,096
- Issue date Oct 29, 2024
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink and method for manufacturing same
- Patent number 11,646,243
- Issue date May 9, 2023
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Heat sink and method for manufacturing same
- Patent number 11,270,926
- Issue date Mar 8, 2022
- JFE PRECISION CORPORATION
- Hoshiaki Terao
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
- Publication number 20220299278
- Publication date Sep 22, 2022
- JFE PRECISION CORPORATION
- Hoshiaki TERAO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK AND METHOD FOR MANUFACTURING SAME
- Publication number 20200395268
- Publication date Dec 17, 2020
- JFE PRECISION CORPORATION
- Hoshiaki TERAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK AND METHOD FOR MANUFACTURING SAME
- Publication number 20200051889
- Publication date Feb 13, 2020
- JFE PRECISION CORPORATION
- Hoshiaki TERAO
- B22 - CASTING POWDER METALLURGY