Kouichi Inoue

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Ibaraki-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Die bond film, dicing die bond film, and semiconductor device
- Patent number 8,779,586
- Issue date Jul 15, 2014
- Nitto Denko Corporation
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR...
- Publication number 20110256666
- Publication date Oct 20, 2011
- Yuki SUGO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE
- Publication number 20110210455
- Publication date Sep 1, 2011
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND ME...
- Publication number 20110120614
- Publication date May 26, 2011
- Yuki Sugo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20110074050
- Publication date Mar 31, 2011
- Yasuhiro Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICON...
- Publication number 20110057331
- Publication date Mar 10, 2011
- Miki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING DICING DIE-BONDING FILM
- Publication number 20100304092
- Publication date Dec 2, 2010
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...