Kouichi Takashima

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element mounting member, method of producing the same...
- Patent number 8,575,625
- Issue date Nov 5, 2013
- A.L.M.T. Corp.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element mounting substrate, semiconductor device usin...
- Patent number 8,178,893
- Issue date May 15, 2012
- A.L.M.T. Corp.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader and semiconductor device using the same
- Patent number 7,768,120
- Issue date Aug 3, 2010
- A.L.M.T. Corp.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor device and semiconductor device
- Patent number 7,470,982
- Issue date Dec 30, 2008
- A.L.M.T. Corp.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor heat-dissipating substrate, and manufacturing method...
- Patent number 7,180,178
- Issue date Feb 20, 2007
- Sumitomo Electric Industries, Ltd.
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor heat-dissipating substrate, and manufacturing method...
- Patent number 6,979,901
- Issue date Dec 27, 2005
- Sumitomo Electric Industries, Ltd.
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Plate type member for semiconductor device package and package
- Patent number 5,990,548
- Issue date Nov 23, 1999
- Sumitomo Electric Industries, Ltd.
- Mitsunori Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE MATERIAL, HEAT SINK AND SEMICONDUCTOR DEVICE
- Publication number 20230167528
- Publication date Jun 1, 2023
- Sumitomo Electric Industries, Ltd.
- Masatoshi MAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT MOUNTING MEMBER, METHOD OF PRODUCING THE SAME...
- Publication number 20120292769
- Publication date Nov 22, 2012
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Element Mounting Substrate, Semiconductor Device Usin...
- Publication number 20090057705
- Publication date Mar 5, 2009
- A. L. M. T. CORP.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and method for manufacturing the same, and semiconduc...
- Publication number 20080298024
- Publication date Dec 4, 2008
- A.L.M.T. CORP.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader and semiconductor device using the same
- Publication number 20080157347
- Publication date Jul 3, 2008
- A.L.M.T. CORP.
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for semiconductor device and semiconductor device
- Publication number 20070194440
- Publication date Aug 23, 2007
- Kouichi Takashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Heat-Dissipating Substrate, and Manufacturing Method...
- Publication number 20050230819
- Publication date Oct 20, 2005
- Sumitomo Electric Industries, Ltd.
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Semicoductor radiating substrate and production method therefor and...
- Publication number 20040135247
- Publication date Jul 15, 2004
- Kouichi Takashima
- B22 - CASTING POWDER METALLURGY

Kouichi Takashima

Person

Patents Grantslast 30 patents

Semiconductor element mounting member, method of producing the same...

Semiconductor element mounting substrate, semiconductor device usin...

Heat spreader and semiconductor device using the same

Substrate for semiconductor device and semiconductor device

Semiconductor heat-dissipating substrate, and manufacturing method...

Semiconductor heat-dissipating substrate, and manufacturing method...

Plate type member for semiconductor device package and package

Patents Applicationslast 30 patents

COMPOSITE MATERIAL, HEAT SINK AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR ELEMENT MOUNTING MEMBER, METHOD OF PRODUCING THE SAME...

Semiconductor Element Mounting Substrate, Semiconductor Device Usin...

Heat spreader and method for manufacturing the same, and semiconduc...

Heat spreader and semiconductor device using the same

Substrate for semiconductor device and semiconductor device

Semiconductor Heat-Dissipating Substrate, and Manufacturing Method...

Semicoductor radiating substrate and production method therefor and...