Kouichi Teshima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder material, device using the same and manufacturing process th...
- Patent number 6,673,310
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, substrate with solder alloy for mounting electronic p...
- Patent number 6,651,870
- Issue date Nov 25, 2003
- Kabushiki Kaisha Toshiba
- Kouichi Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 6,464,122
- Issue date Oct 15, 2002
- Kuroda Techno Co., Ltd.
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and bonding method of substrate and electric or electr...
- Patent number 6,457,632
- Issue date Oct 1, 2002
- Kabushiki Kaisha Toshiba
- Kouichi Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and method of manufacturing solder material
- Patent number 6,386,426
- Issue date May 14, 2002
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus, processing system and processing method
- Patent number 6,332,909
- Issue date Dec 25, 2001
- Kabushiki Kaisha Toshiba
- Kouichi Teshima
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Grant
Substrate with solder alloy for mounting electronic parts
- Patent number 6,280,858
- Issue date Aug 28, 2001
- Kabushiki Kaisha Toshiba
- Kouichi Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining metallic members, and joined metallic members
- Patent number 6,220,501
- Issue date Apr 24, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and method of manufacturing solder material
- Patent number 6,186,390
- Issue date Feb 13, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 6,123,248
- Issue date Sep 26, 2000
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Solder alloy, substrate with solder alloy for mounting electronic p...
- Publication number 20030015574
- Publication date Jan 23, 2003
- Kabushiki Kaisha Toshiba
- Kouichi Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder material, device using the same and manufacturing process th...
- Publication number 20010029095
- Publication date Oct 11, 2001
- Masahiro Tadauchi
- H01 - BASIC ELECTRIC ELEMENTS

Kouichi Teshima

Person

Patents Grantslast 30 patents

Solder material, device using the same and manufacturing process th...

Solder alloy, substrate with solder alloy for mounting electronic p...

Soldering method and soldering apparatus

Solder alloy and bonding method of substrate and electric or electr...

Solder material and method of manufacturing solder material

Processing apparatus, processing system and processing method

Substrate with solder alloy for mounting electronic parts

Method of joining metallic members, and joined metallic members

Solder material and method of manufacturing solder material

Soldering method and soldering apparatus

Patents Applicationslast 30 patents

Solder alloy, substrate with solder alloy for mounting electronic p...

Solder material, device using the same and manufacturing process th...