Kouichi Tsuyama

Person

Ibaraki-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Engraved plate and substrate with conductor layer pattern using the...
- Patent number 8,673,428
- Issue date Mar 18, 2014
- Hitachi Chemical Company, Ltd.
- Susumu Naoyuki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Current protector
- Patent number 5,929,741
- Issue date Jul 27, 1999
- Hitachi Chemical Company, Ltd.
- Atsushi Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protective device and method for fabricating same
- Patent number 5,915,757
- Issue date Jun 29, 1999
- Hitachi Chemical Company, Ltd.
- Kouichi Tsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing multilayer printed circuit board for wire bon...
- Patent number 5,879,568
- Issue date Mar 9, 1999
- Hitachi, Ltd.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protective device
- Patent number 5,714,794
- Issue date Feb 3, 1998
- Hitachi Chemical Company, Ltd.
- Kouichi Tsuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,689,879
- Issue date Nov 25, 1997
- Hitachi Chemical Company, Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a printed wiring board
- Patent number 5,638,598
- Issue date Jun 17, 1997
- Hitachi Chemical Company, Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and production thereof
- Patent number 5,444,189
- Issue date Aug 22, 1995
- Hitachi Chemical Co., Ltd.
- Akishi Nakaso
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil for printed wiring board and production thereof
- Patent number 5,403,672
- Issue date Apr 4, 1995
- Hitachi Chemical Co., Ltd.
- Naoyuki Urasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for metallizing glass surface
- Patent number 4,859,505
- Issue date Aug 22, 1989
- Hitachi Chemical Co., Ltd.
- Hajime Nakayama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ENGRAVED PLATE AND SUBSTRATE WITH CONDUCTOR LAYER PATTERN USING THE...
- Publication number 20100021695
- Publication date Jan 28, 2010
- Susumu Naoyuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Kouichi Tsuyama

Person

Patents Grantslast 30 patents

Engraved plate and substrate with conductor layer pattern using the...

Current protector

Electrostatic protective device and method for fabricating same

Process for producing multilayer printed circuit board for wire bon...

Electrostatic protective device

Metal foil for printed wiring board and production thereof

Process for producing a printed wiring board

Printed wiring board and production thereof

Metal foil for printed wiring board and production thereof

Process for metallizing glass surface

Patents Applicationslast 30 patents

ENGRAVED PLATE AND SUBSTRATE WITH CONDUCTOR LAYER PATTERN USING THE...