Kouichi Yajima

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer protective device and semiconductor wafer treat...
- Patent number 6,943,045
- Issue date Sep 13, 2005
- Disco Corporation
- Masahiko Kitamura
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor chip pick-up method
- Patent number 6,759,274
- Issue date Jul 6, 2004
- Disco Corporation
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating a plate-like workpiece held by adhesion on an...
- Patent number 6,594,890
- Issue date Jul 22, 2003
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method of processing a semiconductor wafer
- Publication number 20040092108
- Publication date May 13, 2004
- Kouichi Yajima
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor chip pickup device
- Publication number 20040091342
- Publication date May 13, 2004
- Kouichi Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip pick-up method
- Publication number 20020025656
- Publication date Feb 28, 2002
- Kazuhisa Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of separating a plate-like workpiece adsorption-held on an e...
- Publication number 20020023340
- Publication date Feb 28, 2002
- Kazuhisa Arai
- B24 - GRINDING POLISHING