Kouji Araki

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Insulating substrate, manufacturing method thereof, and module semi...
- Patent number 7,263,766
- Issue date Sep 4, 2007
- Kabushiki Kaisha Toshiba
- Yutaka Ishiwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating substrate including multilevel insulative ceramic layers...
- Patent number 6,605,868
- Issue date Aug 12, 2003
- Kabushiki Kaisha Toshiba
- Yutaka Ishiwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a laminated plate used in a semiconductor...
- Patent number 5,338,392
- Issue date Aug 16, 1994
- Kabushiki Kaisha Toshiba
- Kouji Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-seal type semiconductor device
- Patent number 5,332,921
- Issue date Jul 26, 1994
- Kabushiki Kaisha Toshiba
- Noriaki Dousen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,295,044
- Issue date Mar 15, 1994
- Kabushiki Kaisah Toshiba
- Kouji Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted upon an insulating adhesive with silic...
- Patent number 5,113,241
- Issue date May 12, 1992
- Kabushiki Kaisha Toshiba
- Satoru Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding means having an improved capillary and method...
- Patent number 4,911,350
- Issue date Mar 27, 1990
- Kabushiki Kaisha Toshiba
- Kouji Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Insulating substrate, manufacturing method thereof, and module semi...
- Publication number 20030168729
- Publication date Sep 11, 2003
- Kabushiki Kaisha Toshiba
- Yutaka Ishiwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING SUBSTRATE INCLUDING MULTILEVEL INSULATIVE CERAMIC LAYERS...
- Publication number 20020066953
- Publication date Jun 6, 2002
- YUTAKA ISHIWATA
- H01 - BASIC ELECTRIC ELEMENTS

Kouji Araki

Person

Patents Grantslast 30 patents

Insulating substrate, manufacturing method thereof, and module semi...

Insulating substrate including multilevel insulative ceramic layers...

Method for manufacturing a laminated plate used in a semiconductor...

Resin-seal type semiconductor device

Semiconductor device

Semiconductor device mounted upon an insulating adhesive with silic...

Semiconductor bonding means having an improved capillary and method...

Patents Applicationslast 30 patents

Insulating substrate, manufacturing method thereof, and module semi...

INSULATING SUBSTRATE INCLUDING MULTILEVEL INSULATIVE CERAMIC LAYERS...