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Kouji Hirotani
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Osaka, JP
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Patents Grants
last 30 patents
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Patent Grant
Bump bonding device and bump bonding method
Patent number
6,481,616
Issue date
Nov 19, 2002
Matsushita Electric Industrial Co. Ltd.
Makoto Imanishi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bump bonding device and bump bonding method
Patent number
6,328,196
Issue date
Dec 11, 2001
Matsushita Electric Industrial Co., Ltd.
Makoto Imanishi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Bump bonding device and bump bonding method
Publication number
20020030087
Publication date
Mar 14, 2002
Makoto Imanishi
H01 - BASIC ELECTRIC ELEMENTS