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Kouji Kondo
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Toyohashi-city, JP
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Patents Grants
last 30 patents
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Patent Grant
Laminated multi-layer circuit board
Patent number
8,143,529
Issue date
Mar 27, 2012
Denso Corporation
Toshikazu Harada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer substrate having conductive pattern and resin film and...
Patent number
7,733,665
Issue date
Jun 8, 2010
Denso Corporation
Toshikazu Harada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat-resistant insulating film, raw substrate for printed wiring bo...
Patent number
6,228,467
Issue date
May 8, 2001
Mitsubishi Plastics, Inc.
Kouichirou Taniguchi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
Method of manufacturing multilayer printed circuit board
Publication number
20090057265
Publication date
Mar 5, 2009
DENSO CORPORATION
Yoshihiko Shiraishi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Laminated multi-layer circuit board
Publication number
20080149374
Publication date
Jun 26, 2008
DENSO CORPORATION
Toshikazu Harada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layer substrate having conductive pattern and resin film and...
Publication number
20060278963
Publication date
Dec 14, 2006
DENSO CORPORATION
Toshikazu Harada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and apparatus of recycling printed circuit board
Publication number
20050246879
Publication date
Nov 10, 2005
Rikiya Kamimura
B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information
Patent Application
Method and appratus of recycling printed circuit board
Publication number
20040111854
Publication date
Jun 17, 2004
Rikiya Kamimura
B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL