Kouji NISHIMURA

Person

Omuta-shi, Fukuoka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic circuit board and production method therefor
- Patent number 11,483,926
- Issue date Oct 25, 2022
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board, method for manufacturing ceramic circuit boa...
- Patent number 11,452,204
- Issue date Sep 20, 2022
- DENKA COMPANY LIMITED
- Yusaku Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit substrate
- Patent number 11,430,727
- Issue date Aug 30, 2022
- DENKA COMPANY LIMITED
- Ryota Aono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic circuit board and method for producing same
- Patent number 11,277,908
- Issue date Mar 15, 2022
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit substrate and method for manufacturing same
- Patent number 10,796,925
- Issue date Oct 6, 2020
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
- Publication number 20210176859
- Publication date Jun 10, 2021
- DENKA COMPANY LIMITED
- Akimasa YUASA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND MODULE USING SAME
- Publication number 20210176860
- Publication date Jun 10, 2021
- DENKA COMPANY LIMITED
- Yuta TSUGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT SUBSTRATE
- Publication number 20200185320
- Publication date Jun 11, 2020
- DENKA COMPANY LIMITED
- Ryota AONO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- Publication number 20200163210
- Publication date May 21, 2020
- DENKA COMPANY LIMITED
- Akimasa YUASA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOA...
- Publication number 20200128664
- Publication date Apr 23, 2020
- DENKA COMPANY LIMITED
- Yusaku HARADA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190115228
- Publication date Apr 18, 2019
- Denka Company Limited
- Akimasa YUASA
- H01 - BASIC ELECTRIC ELEMENTS

Kouji NISHIMURA

Person

Patents Grantslast 30 patents

Ceramic circuit board and production method therefor

Ceramic circuit board, method for manufacturing ceramic circuit boa...

Ceramic circuit substrate

Ceramic circuit board and method for producing same

Ceramic circuit substrate and method for manufacturing same

Patents Applicationslast 30 patents

CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

CERAMIC CIRCUIT BOARD AND MODULE USING SAME

CERAMIC CIRCUIT SUBSTRATE

CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

CERAMIC CIRCUIT BOARD, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOA...

CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME