Kouji Numazaki

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with pocket for sealing material
- Patent number 5,917,246
- Issue date Jun 29, 1999
- Nippondenso Co., Ltd.
- Hirokazu Kasuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer
- Patent number 5,739,546
- Issue date Apr 14, 1998
- Nippondenso Co., Ltd.
- Mitsuhiro Saitou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constitution of an electrode arrangement in a semiconductor element
- Patent number 5,554,881
- Issue date Sep 10, 1996
- Nippondenso Co., Ltd.
- Takahisa Koyasu
- H01 - BASIC ELECTRIC ELEMENTS