Kouji Shika

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Fukuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of positioning lead frame on molding die to seal semiconduct...
- Patent number 5,288,698
- Issue date Feb 22, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Toshinobu Banjo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding device for sealing semiconductor element with resin
- Patent number 5,123,823
- Issue date Jun 23, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Toshinobu Banjo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL