TREA

Kouji Tomita

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  • Tokyo, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Frame for semiconductor package
    • Publication number 20050106777
    • Publication date May 19, 2005
    • Dainippon Printing Co., Ltd.
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Frame for semiconductor package
    • Publication number 20030098503
    • Publication date May 29, 2003
    • Dainippon Printing Co., Ltd.
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Lead frame and semiconductor package
    • Publication number 20020149090
    • Publication date Oct 17, 2002
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Process for making a semiconductor package
    • Publication number 20020048851
    • Publication date Apr 25, 2002
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor package
    • Publication number 20020027297
    • Publication date Mar 7, 2002
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Frame for semiconductor package
    • Publication number 20010045630
    • Publication date Nov 29, 2001
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Frame for semiconductor package
    • Publication number 20010045628
    • Publication date Nov 29, 2001
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Frame for semiconductor package
    • Publication number 20010042904
    • Publication date Nov 22, 2001
    • Chikao Ikenaga
    • H01 - BASIC ELECTRIC ELEMENTS