Koushik Ramachandran

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Waveguide cores with a dual-trapezoidal shape
- Patent number 12,135,456
- Issue date Nov 5, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Grant
Photonics chips including cavities with non-right-angle internal co...
- Patent number 11,828,983
- Issue date Nov 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Grant
Pic structure having barrier surrounding opening for optical elemen...
- Patent number 11,804,452
- Issue date Oct 31, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered substrates of semiconductor devices
- Patent number 11,502,106
- Issue date Nov 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Benjamin Vito Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with ultra-low-K dielectric region between...
- Patent number 11,502,400
- Issue date Nov 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Selaka B. Bulumulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package with ultra-low-K dielectric region between...
- Patent number 11,075,453
- Issue date Jul 27, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Selaka B. Bulumulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic die fan out package with edge fiber coupling interface and...
- Patent number 10,598,860
- Issue date Mar 24, 2020
- GLOBALFOUNDRIES Inc.
- Koushik Ramachandran
- G02 - OPTICS
Information Patent Grant
PIC die packaging using magnetics to position optical element
- Patent number 10,409,014
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Inc.
- Koushik Ramachandran
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
LASER CHIPS ATTACHED TO A PHOTONICS CHIP BY MULTIPLE ADHESIVES
- Publication number 20240348005
- Publication date Oct 17, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE COUPLERS WITH A FINE-ALIGNMENT MECHANISM
- Publication number 20240219636
- Publication date Jul 4, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Bartlomiej Jan Pawlak
- G02 - OPTICS
Information Patent Application
CAVITY-MOUNTED CHIPS WITH MULTIPLE ADHESIVES
- Publication number 20240154384
- Publication date May 9, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Zhuojie Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE CORES WITH A DUAL-TRAPEZOIDAL SHAPE
- Publication number 20230417991
- Publication date Dec 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Yusheng Bian
- G02 - OPTICS
Information Patent Application
PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...
- Publication number 20230228940
- Publication date Jul 20, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Application
PIC STRUCTURE HAVING BARRIER SURROUNDING OPENING FOR OPTICAL ELEMEN...
- Publication number 20230030723
- Publication date Feb 2, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Nicholas A. Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS PACKAGE WITH ULTRA-LOW-K DIELECTRIC REGION BETWEEN...
- Publication number 20210273323
- Publication date Sep 2, 2021
- GLOBALFOUNDRIES U.S. Inc.
- Selaka B. Bulumulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED SUBSTRATES OF SEMICONDUCTOR DEVICES
- Publication number 20210249442
- Publication date Aug 12, 2021
- GLOBALFOUNDRIES U.S. Inc.
- BENJAMIN VITO FASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC DIE FAN OUT PACKAGE WITH EDGE FIBER COUPLING INTERFACE AND...
- Publication number 20190285804
- Publication date Sep 19, 2019
- GLOBALFOUNDRIES INC.
- Koushik Ramachandran
- G02 - OPTICS
Information Patent Application
FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID
- Publication number 20180166356
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- Shahid A. Butt
- H01 - BASIC ELECTRIC ELEMENTS

Koushik Ramachandran

Person

Patents Grantslast 30 patents

Waveguide cores with a dual-trapezoidal shape

Photonics chips including cavities with non-right-angle internal co...

Pic structure having barrier surrounding opening for optical elemen...

Multi-layered substrates of semiconductor devices

Microelectronics package with ultra-low-K dielectric region between...

Microelectronics package with ultra-low-K dielectric region between...

Photonic die fan out package with edge fiber coupling interface and...

PIC die packaging using magnetics to position optical element

Patents Applicationslast 30 patents

LASER CHIPS ATTACHED TO A PHOTONICS CHIP BY MULTIPLE ADHESIVES

EDGE COUPLERS WITH A FINE-ALIGNMENT MECHANISM

CAVITY-MOUNTED CHIPS WITH MULTIPLE ADHESIVES

WAVEGUIDE CORES WITH A DUAL-TRAPEZOIDAL SHAPE

PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...

PIC STRUCTURE HAVING BARRIER SURROUNDING OPENING FOR OPTICAL ELEMEN...

MICROELECTRONICS PACKAGE WITH ULTRA-LOW-K DIELECTRIC REGION BETWEEN...

MULTI-LAYERED SUBSTRATES OF SEMICONDUCTOR DEVICES

PHOTONIC DIE FAN OUT PACKAGE WITH EDGE FIBER COUPLING INTERFACE AND...

FAN-OUT CIRCUIT PACKAGING WITH INTEGRATED LID