Kousuke Hiroki

Follow

Person

Tsukuba-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Connection board, and multi-layer wiring board, substrate for semic...
- Patent number 8,028,402
- Issue date Oct 4, 2011
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Connection board, and multi-layer wiring board, substrate for semic...
- Publication number 20090008141
- Publication date Jan 8, 2009
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080289868
- Publication date Nov 27, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080010819
- Publication date Jan 17, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection substrate, multi-layer wiring board using the connection...
- Publication number 20060162956
- Publication date Jul 27, 2006
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR