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Kouzou Hirokawa
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Shimodate, JP
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last 30 patents
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Patent Grant
Epoxy resin composition for sealing photosemiconductor element and...
Patent number
5,641,840
Issue date
Jun 24, 1997
Hitachi Chemical Company, Ltd.
Satoru Tsuchida
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...