Kozo FUJIMOTO

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OSAKA, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of mounting electronic component to circuit board
- Patent number 9,807,889
- Issue date Oct 31, 2017
- Osaka University
- Kozo Fujimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Manufacturing method of semiconductor module including solid-liquid...
- Patent number 7,670,879
- Issue date Mar 2, 2010
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of interconnecting terminals and method of mounting semicond...
- Patent number 7,524,748
- Issue date Apr 28, 2009
- Senju Metal Industry Co., Ltd.
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOIN...
- Publication number 20140029224
- Publication date Jan 30, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Kozo FUJIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of semiconductor module
- Publication number 20070197017
- Publication date Aug 23, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting method
- Publication number 20070152025
- Publication date Jul 5, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of interconnecting terminals and method for mounting semicon...
- Publication number 20070001313
- Publication date Jan 4, 2007
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR