Kozo Yamasaki

Person

Kani, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board with built-in component and method for manufacturing t...
- Patent number 7,936,567
- Issue date May 3, 2011
- NGK Spark Plug Co., Ltd.
- Tsuneaki Takashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring substrates, metal plate for...
- Patent number 6,976,415
- Issue date Dec 20, 2005
- NGK Spark Plug Co., Ltd.
- Tomoe Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring substrates, metal plate for...
- Patent number 6,872,436
- Issue date Mar 29, 2005
- NGK Spark Plug Co. Ltd.
- Tomoe Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer-wiring substrate and method for fabricating same
- Patent number 6,674,017
- Issue date Jan 6, 2004
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making laminate ceramic substrate with domed pads
- Patent number 6,224,703
- Issue date May 1, 2001
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting board for connection between base plate and mounting board
- Patent number 6,148,900
- Issue date Nov 21, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a printed board
- Patent number 6,139,904
- Issue date Oct 31, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting board
- Patent number 6,115,913
- Issue date Sep 12, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting board with oval-shaped protrusions
- Patent number 6,080,936
- Issue date Jun 27, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a ceramic package main body
- Patent number 6,077,728
- Issue date Jun 20, 2000
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball interposer
- Patent number D423533
- Issue date Apr 25, 2000
- NGK Spark Plug Co., Ltd
- Kozo Yamasaki
- D15 - Machines not elsewhere specified
Information Patent Grant
Solder column interposer
- Patent number D423532
- Issue date Apr 25, 2000
- NGK Spark Plug Co., Ltd
- Kozo Yamasaki
- D15 - Machines not elsewhere specified
Information Patent Grant
Solder ball interposer
- Patent number D423027
- Issue date Apr 18, 2000
- NGK Spark Plug Co., Ltd
- Kozo Yamasaki
- D15 - Machines not elsewhere specified
Information Patent Grant
Wired board with improved bonding pads
- Patent number 6,018,197
- Issue date Jan 25, 2000
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting board for connection between base plate and mounting board
- Patent number 5,859,407
- Issue date Jan 12, 1999
- NGK Spark Plug Co., Ltd.
- Hajime Saiki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a ceramic package main body
- Patent number 5,822,851
- Issue date Oct 20, 1998
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic package main body
- Patent number 5,621,190
- Issue date Apr 15, 1997
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High heat conductive body and wiring base substrate fitted with the...
- Patent number 5,545,598
- Issue date Aug 13, 1996
- NGK Spark Plug Co., Ltd.
- Kouki Ogawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Alumina multilayer wiring substrate provided with high dielectric m...
- Patent number 5,099,388
- Issue date Mar 24, 1992
- NGK Spark Plug Co., Ltd.
- Masahiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple resistivity wiring apparatus
- Patent number 5,060,049
- Issue date Oct 22, 1991
- NGK Spark Plug Co., Ltd.
- Kozo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING T...
- Publication number 20080277150
- Publication date Nov 13, 2008
- NGK SPARK PLUG CO., LTD.
- Tsuneaki Takashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing printed wiring substrates, metal plate for...
- Publication number 20050155789
- Publication date Jul 21, 2005
- NGK SPARK PLUG CO., LTD.
- Tomoe Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for manufacturing printed wiring substrates, metal plate for...
- Publication number 20040018373
- Publication date Jan 29, 2004
- Tomoe Suzuki
- B32 - LAYERED PRODUCTS

Kozo Yamasaki

Person

Patents Grantslast 30 patents

Wiring board with built-in component and method for manufacturing t...

Method for manufacturing printed wiring substrates, metal plate for...

Method for manufacturing printed wiring substrates, metal plate for...

Multilayer-wiring substrate and method for fabricating same

Method of making laminate ceramic substrate with domed pads

Connecting board for connection between base plate and mounting board

Method of making a printed board

Connecting board

Connecting board with oval-shaped protrusions

Method of producing a ceramic package main body

Solder ball interposer

Solder column interposer

Solder ball interposer

Wired board with improved bonding pads

Connecting board for connection between base plate and mounting board

Method of producing a ceramic package main body

Ceramic package main body

High heat conductive body and wiring base substrate fitted with the...

Alumina multilayer wiring substrate provided with high dielectric m...

Multiple resistivity wiring apparatus

Patents Applicationslast 30 patents

WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING T...

Method for manufacturing printed wiring substrates, metal plate for...

Method for manufacturing printed wiring substrates, metal plate for...