Krishna K. Nair

Person

Apex, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic structures including conductive layers comprising copper...
- Patent number 8,294,269
- Issue date Oct 23, 2012
- Unitive International
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic structures including conductive shunt...
- Patent number 7,879,715
- Issue date Feb 1, 2011
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic structures including conductive shunt...
- Patent number 7,297,631
- Issue date Nov 20, 2007
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature methods of bonding components and related structures
- Patent number 7,156,284
- Issue date Jan 2, 2007
- Unitive International Limited
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic structures including conductive shunt layers
- Patent number 6,960,828
- Issue date Nov 1, 2005
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature methods of bonding components
- Patent number 6,863,209
- Issue date Mar 8, 2005
- Unitivie International Limited
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Structures Including Conductive Layers Comprising Copper...
- Publication number 20110084392
- Publication date Apr 14, 2011
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT...
- Publication number 20080026560
- Publication date Jan 31, 2008
- UNITIVE INTERNATIONAL LIMITED
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature methods of bonding components and related structures
- Publication number 20070040003
- Publication date Feb 22, 2007
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming electronic structures including conductive shunt...
- Publication number 20060009023
- Publication date Jan 12, 2006
- UNITIVE INTERNATIONAL LIMITED
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature methods of bonding components and related structures
- Publication number 20040169064
- Publication date Sep 2, 2004
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming electronic structures including conductive shunt...
- Publication number 20040053483
- Publication date Mar 18, 2004
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature methods of bonding components and related structures
- Publication number 20020074381
- Publication date Jun 20, 2002
- Unitive International Limited
- Glenn A. Rinne
- G02 - OPTICS

Krishna K. Nair

Person

Patents Grantslast 30 patents

Electronic structures including conductive layers comprising copper...

Methods of forming electronic structures including conductive shunt...

Methods of forming electronic structures including conductive shunt...

Low temperature methods of bonding components and related structures

Electronic structures including conductive shunt layers

Low temperature methods of bonding components

Patents Applicationslast 30 patents

Electronic Structures Including Conductive Layers Comprising Copper...

METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT...

Low temperature methods of bonding components and related structures

Methods of forming electronic structures including conductive shunt...

Low temperature methods of bonding components and related structures

Methods of forming electronic structures including conductive shunt...

Low temperature methods of bonding components and related structures