Krishna Vepa

Person

Livermore, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process tool chemical and gas usage optimization
- Patent number 8,874,416
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Krishna Vepa
- G05 - CONTROLLING REGULATING
Information Patent Grant
Edge removal of silicon-on-insulator transfer wafer
- Patent number 7,951,718
- Issue date May 31, 2011
- Applied Materials, Inc.
- Raymond John Donohoe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for removal of surface films from reclaim substrates
- Patent number 7,775,856
- Issue date Aug 17, 2010
- Applied Materials, Inc.
- Yashraj K. Bhatnagar
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for improving incoming and outgoing wafer inspection prod...
- Patent number 7,727,782
- Issue date Jun 1, 2010
- Applied Materials, Inc.
- Yashraj K. Bhatnagar
- G01 - MEASURING TESTING
Information Patent Grant
Refurbishing a wafer having a low-k dielectric layer
- Patent number 7,695,982
- Issue date Apr 13, 2010
- Applied Matreials, Inc.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of silicon oxycarbide from substrates
- Patent number 7,659,206
- Issue date Feb 9, 2010
- Applied Materials, Inc.
- Krishna Vepa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reclaiming substrates having defects and contaminants
- Patent number 7,657,390
- Issue date Feb 2, 2010
- Applied Materials, Inc.
- Krishna Vepa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge removal of silicon-on-insulator transfer wafer
- Patent number 7,402,520
- Issue date Jul 22, 2008
- Applied Materials, Inc.
- Raymond John Donohoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Refreshing wafers having low-k dielectric materials
- Patent number 7,208,325
- Issue date Apr 24, 2007
- Applied Materials, Inc.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS TOOL CHEMICAL AND GAS USAGE OPTIMIZATION
- Publication number 20120143574
- Publication date Jun 7, 2012
- Krishna Vepa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FACTORY RESOURCE OPTIMIZATION IDENTIFICATION PROCESS AND SYSTEM
- Publication number 20100249968
- Publication date Sep 30, 2010
- Andreas Neuber
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR REMOVAL OF SURFACE FILMS FROM RECLAIM SUBSTRATES
- Publication number 20090088049
- Publication date Apr 2, 2009
- Yashraj K. Bhatnagar
- B24 - GRINDING POLISHING
Information Patent Application
Edge Removal Of Silicon-On-Insulator Transfer Wafer
- Publication number 20090061545
- Publication date Mar 5, 2009
- Applied Materials, Inc.
- Raymond John Donohoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer reclaim method based on wafer type
- Publication number 20080318343
- Publication date Dec 25, 2008
- Krishna Vepa
- G01 - MEASURING TESTING
Information Patent Application
Apparatus for improving incoming and outgoing wafer inspection prod...
- Publication number 20080318350
- Publication date Dec 25, 2008
- Yashraj K. Bhatnagar
- G01 - MEASURING TESTING
Information Patent Application
EDGE REMOVAL OF SILICON-ON-INSULATOR TRANSFER WAFER
- Publication number 20080138987
- Publication date Jun 12, 2008
- Applied Materials, Inc.
- Raymond John Donohoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER BY CHEMICAL MECHANIC...
- Publication number 20070190791
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER
- Publication number 20070190798
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE GRINDING A LOW-K DIELECTRIC LAYER OFF A WAFER
- Publication number 20070190790
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFURBISHING A WAFER HAVING A LOW-K DIELECTRIC LAYER
- Publication number 20070190799
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reclaiming substrates having defects and contaminants
- Publication number 20070099310
- Publication date May 3, 2007
- APPLIED MATERIALS, INC.
- Krishna Vepa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removal of silicon oxycarbide from substrates
- Publication number 20060240675
- Publication date Oct 26, 2006
- APPLIED MATERIALS, INC.
- Krishna Vepa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Refreshing wafers having low-k dielectric materials
- Publication number 20060160364
- Publication date Jul 20, 2006
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge removal of silicon-on-insulator transfer wafer
- Publication number 20060115986
- Publication date Jun 1, 2006
- APPLIED MATERIALS, INC.
- Raymond John Donohoe
- H01 - BASIC ELECTRIC ELEMENTS

Krishna Vepa

Person

Patents Grantslast 30 patents

Process tool chemical and gas usage optimization

Edge removal of silicon-on-insulator transfer wafer

Method for removal of surface films from reclaim substrates

Apparatus for improving incoming and outgoing wafer inspection prod...

Refurbishing a wafer having a low-k dielectric layer

Removal of silicon oxycarbide from substrates

Reclaiming substrates having defects and contaminants

Edge removal of silicon-on-insulator transfer wafer

Refreshing wafers having low-k dielectric materials

Patents Applicationslast 30 patents

PROCESS TOOL CHEMICAL AND GAS USAGE OPTIMIZATION

FACTORY RESOURCE OPTIMIZATION IDENTIFICATION PROCESS AND SYSTEM

METHOD FOR REMOVAL OF SURFACE FILMS FROM RECLAIM SUBSTRATES

Edge Removal Of Silicon-On-Insulator Transfer Wafer

Wafer reclaim method based on wafer type

Apparatus for improving incoming and outgoing wafer inspection prod...

EDGE REMOVAL OF SILICON-ON-INSULATOR TRANSFER WAFER

REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER BY CHEMICAL MECHANIC...

REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER

FINE GRINDING A LOW-K DIELECTRIC LAYER OFF A WAFER

REFURBISHING A WAFER HAVING A LOW-K DIELECTRIC LAYER

Reclaiming substrates having defects and contaminants

Removal of silicon oxycarbide from substrates

Refreshing wafers having low-k dielectric materials

Edge removal of silicon-on-insulator transfer wafer