Kristen L. Holverson

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Williston, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermally sensitive material embedded in the substrate
- Patent number 8,426,856
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Grant
Low profile heat sink for semiconductor devices
- Patent number 8,230,903
- Issue date Jul 31, 2012
- International Business Machines Corporation
- Stephen P. Ayotte
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY SENSITIVE MATERIAL EMBEDDED IN THE SUBSTRATE
- Publication number 20120007074
- Publication date Jan 12, 2012
- International Business Machines Corporation
- Stephen P. Ayotte
- G01 - MEASURING TESTING
Information Patent Application
LOW PROFILE HEAT SINK FOR SEMICONDUCTOR DEVICES
- Publication number 20090260778
- Publication date Oct 22, 2009
- International Business Machines Corporation
- Stephen P. Ayotte
- F28 - HEAT EXCHANGE IN GENERAL