Kristopher Frutschy

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Radiant energy heating for die attach
- Patent number 7,691,671
- Issue date Apr 6, 2010
- Intel Corporation
- Kristopher J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a microelectronic package using control of die an...
- Patent number 7,585,693
- Issue date Sep 8, 2009
- Intel Corporation
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated package inductor for integrated circuit devices
- Patent number 7,209,026
- Issue date Apr 24, 2007
- Intel Corporation
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiant energy heating for die attach
- Patent number 7,187,066
- Issue date Mar 6, 2007
- Intel Corporation
- Kristopher J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stiffener
- Patent number 7,173,329
- Issue date Feb 6, 2007
- Intel Corporation
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground plane for integrated circuit package
- Patent number 7,154,175
- Issue date Dec 26, 2006
- Intel Corporation
- Udy A. Shrivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for a microelectronic component having reduced electrical re...
- Patent number 7,131,850
- Issue date Nov 7, 2006
- Intel Corporation
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Induction-based heating for chip attach
- Patent number 7,064,004
- Issue date Jun 20, 2006
- Intel Corporation
- Kristopher J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader and stiffener having a stiffener extension
- Patent number 7,045,890
- Issue date May 16, 2006
- Intel Corporation
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board housing clamp
- Patent number 6,975,518
- Issue date Dec 13, 2005
- Intel Corporation
- Kristopher Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication for a socket with embedded conductive structure
- Patent number 6,877,223
- Issue date Apr 12, 2005
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct BGA attachment without solder reflow
- Patent number 6,750,551
- Issue date Jun 15, 2004
- Intel Corporation
- Kristopher Frutschy
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,661,660
- Issue date Dec 9, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Patent number 6,639,799
- Issue date Oct 28, 2003
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit housing clamp and method of manufacture therefor
- Patent number 6,586,684
- Issue date Jul 1, 2003
- Intel Corporation
- Kristopher Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having a heat pipe that conducts heat from a se...
- Patent number 6,535,386
- Issue date Mar 18, 2003
- Intel Corporation
- Ajit V. Sathe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Socket with embedded conductive structure and method of fabrication...
- Patent number 6,428,358
- Issue date Aug 6, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling the heat expansion of electrical couplings
- Patent number 6,221,459
- Issue date Apr 24, 2001
- Intel Corporation
- Gregory A. James
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a microelectronic package using control of die an...
- Publication number 20070231952
- Publication date Oct 4, 2007
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STIFFENER
- Publication number 20070120149
- Publication date May 31, 2007
- Intel Corporation
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiant energy heating for die attach
- Publication number 20070048904
- Publication date Mar 1, 2007
- Kristopher J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiant energy heating for die attach
- Publication number 20060060979
- Publication date Mar 23, 2006
- Kristopher J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated package inductor for integrated circuit devices
- Publication number 20060044101
- Publication date Mar 2, 2006
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ground plane for integrated circuit package
- Publication number 20050280138
- Publication date Dec 22, 2005
- Udy A. Shrivastava
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Induction-based heating for chip attach
- Publication number 20050142695
- Publication date Jun 30, 2005
- Kristopher J. Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Socket for a microelectronic component having reduced electrical re...
- Publication number 20050026465
- Publication date Feb 3, 2005
- Kristopher J. Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board housing clamp
- Publication number 20030173111
- Publication date Sep 18, 2003
- Intel Corporation
- Kristopher Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangements to supply power to semiconductor package
- Publication number 20030062602
- Publication date Apr 3, 2003
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements to increase structural rigidity of semiconductor package
- Publication number 20030062618
- Publication date Apr 3, 2003
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit housing clamp and method of manufacture therefor
- Publication number 20030000739
- Publication date Jan 2, 2003
- Intel Corporation
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabrication for a socket with embedded conductive structure
- Publication number 20020151218
- Publication date Oct 17, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET WITH EMBEDDED CONDUCTIVE STRUCTURE
- Publication number 20020086568
- Publication date Jul 4, 2002
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Publication number 20020080583
- Publication date Jun 27, 2002
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vapor chamber heat sink and spreader and an embedded dir...
- Publication number 20020080584
- Publication date Jun 27, 2002
- Intel Corporation
- Ravi Prasher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly having a heat pipe that conducts heat from a se...
- Publication number 20020067598
- Publication date Jun 6, 2002
- Ajit V. Sathe
- F28 - HEAT EXCHANGE IN GENERAL

Kristopher Frutschy

Person

Patents Grantslast 30 patents

Radiant energy heating for die attach

Method of forming a microelectronic package using control of die an...

Integrated package inductor for integrated circuit devices

Radiant energy heating for die attach

Package stiffener

Ground plane for integrated circuit package

Socket for a microelectronic component having reduced electrical re...

Induction-based heating for chip attach

Heat spreader and stiffener having a stiffener extension

Printed circuit board housing clamp

Method of fabrication for a socket with embedded conductive structure

Direct BGA attachment without solder reflow

Integrated vapor chamber heat sink and spreader and an embedded dir...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Circuit housing clamp and method of manufacture therefor

Electronic assembly having a heat pipe that conducts heat from a se...

Socket with embedded conductive structure and method of fabrication...

Controlling the heat expansion of electrical couplings

Patents Applicationslast 30 patents

Method of forming a microelectronic package using control of die an...

PACKAGE STIFFENER

Radiant energy heating for die attach

Radiant energy heating for die attach

Integrated package inductor for integrated circuit devices

Ground plane for integrated circuit package

Induction-based heating for chip attach

Socket for a microelectronic component having reduced electrical re...

Printed circuit board housing clamp

Arrangements to supply power to semiconductor package

Arrangements to increase structural rigidity of semiconductor package

Circuit housing clamp and method of manufacture therefor

Method of fabrication for a socket with embedded conductive structure

SOCKET WITH EMBEDDED CONDUCTIVE STRUCTURE

Integrated vapor chamber heat sink and spreader and an embedded dir...

Integrated vapor chamber heat sink and spreader and an embedded dir...

Electronic assembly having a heat pipe that conducts heat from a se...