Kristopher K. Hearn

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of attaching a module on wafer substrate
- Patent number 9,514,970
- Issue date Dec 6, 2016
- KLA-Tencor Corporation
- Vaibhaw Vishal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE
- Publication number 20140202267
- Publication date Jul 24, 2014
- KLA-Tencor Corporation
- Vaibhaw Vishal
- H01 - BASIC ELECTRIC ELEMENTS