Ku-Bong Kim

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Seoul, KR

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Patents Applicationslast 30 patents

Information Patent Application
Semiconductor packages including thermal stress buffers and methods...
- Publication number 20080315379
- Publication date Dec 25, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Ku-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor plating system for plating semiconductor object
- Publication number 20080141933
- Publication date Jun 19, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Cha-jea Jo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
UPNP-BASED MEDIA CONTENTS REPRODUCING SYSTEM AND METHOD THEREOF
- Publication number 20080005272
- Publication date Jan 3, 2008
- Ku-Bong Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE