Ku-Feng Yang

Person

Dali City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Selective epitaxy process for the formation of CFET local interconn...
- Patent number 12,131,954
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and isolation techniques for stacked transistor structures
- Patent number 12,132,079
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 12,087,732
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structure and method forming same
- Patent number 12,074,064
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous dielectric bonding scheme
- Patent number 11,869,869
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having backside interconnect...
- Patent number 11,823,979
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 11,721,666
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,688,639
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 11,585,008
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for wafer pre-wetting
- Patent number 11,585,005
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
TSV structure and method forming same
- Patent number 11,527,439
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate vias with improved connections
- Patent number 11,296,011
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 11,101,240
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 11,056,419
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 11,004,741
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 10,566,237
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,510,604
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 10,510,641
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate vias with improved connections
- Patent number 10,340,205
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,269,761
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure extending to metallization layer
- Patent number 10,170,396
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 10,163,705
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,163,709
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,157,866
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment for redistribution layer
- Patent number 10,074,595
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Company
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 9,953,920
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS DIELECTRIC BONDING SCHEME
- Publication number 20240387449
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240379748
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV STRUCTURE AND METHOD FORMING SAME
- Publication number 20240363411
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE
- Publication number 20240355696
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE PATTERNING FOR STACKED DEVICE STRUCTURE USING SELF-ASSEMBLED M...
- Publication number 20240312846
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240282815
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding and Isolation Techniques for Stacked Transistor Structures
- Publication number 20240282814
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20240274485
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che Chi Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Dielectric Bonding Scheme
- Publication number 20240096847
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FEATURES OF A SEMICONDUCTOR DEVICE AND METHODS FOR FORMING TH...
- Publication number 20240014282
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411326
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Bonding Film for Semiconductor Packages and Methods of Fo...
- Publication number 20230343747
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230317648
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260940
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER PRE-WETTING
- Publication number 20230167568
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV Structure and Method Forming Same
- Publication number 20220359292
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Dielectric Bonding Scheme
- Publication number 20220344301
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR WAFER PRE-WETTING
- Publication number 20220220624
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20220205126
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV Structure and Method Forming Same
- Publication number 20220093461
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Bonding Film for Semiconductor Packages and Methods of Fo...
- Publication number 20210384158
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device Having Backside Interconnect...
- Publication number 20210335694
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Substrate Vias with Improved Connections
- Publication number 20210125900
- Publication date Apr 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20210050316
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Bonding Film for Semiconductor Packages and Methods of Fo...
- Publication number 20200411472
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20200144119
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS

Ku-Feng Yang

Person

Patents Grantslast 30 patents

Selective epitaxy process for the formation of CFET local interconn...

Bonding structures of integrated circuit devices and method forming...

Bonding and isolation techniques for stacked transistor structures

Isolation bonding film for semiconductor packages and methods of fo...

TSV structure and method forming same

Bonding structures of integrated circuit devices and method forming...

Heterogeneous dielectric bonding scheme

Method of forming semiconductor device having backside interconnect...

Interconnect structure and method of forming same

Isolation bonding film for semiconductor packages and methods of fo...

Semiconductor device and method

Plating apparatus for plating semiconductor wafer and plating method

Apparatus and method for wafer pre-wetting

TSV structure and method forming same

Through-substrate vias with improved connections

Isolation bonding film for semiconductor packages and methods of fo...

Semiconductor device having backside interconnect structure on thro...

Profile of through via protrusion in 3DIC interconnect

Interconnect structure and method of forming same

Profile of through via protrusion in 3DIC interconnect

Semiconductor device and method

Semiconductor device having backside interconnect structure on thro...

Through substrate vias with improved connections

Semiconductor device and method

Through via structure extending to metallization layer

Profile of through via protrusion in 3DIC interconnect

Semiconductor device and method

Interconnect structure and method of forming same

Self-alignment for redistribution layer

Interconnect structure and method

Patents Applicationslast 30 patents

HETEROGENEOUS DIELECTRIC BONDING SCHEME

Bonding and Isolation Techniques for Stacked Transistor Structures

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

TSV STRUCTURE AND METHOD FORMING SAME

METHOD OF FILLING GAPS BETWEEN DIES USING SILICON DIOXIDE

GATE PATTERNING FOR STACKED DEVICE STRUCTURE USING SELF-ASSEMBLED M...

Bonding and Isolation Techniques for Stacked Transistor Structures

Bonding and Isolation Techniques for Stacked Transistor Structures

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

Heterogeneous Dielectric Bonding Scheme

METAL FEATURES OF A SEMICONDUCTOR DEVICE AND METHODS FOR FORMING TH...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Having Backside Interconnect Structure on Thr...

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

Isolation Bonding Film for Semiconductor Packages and Methods of Fo...

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD FOR WAFER PRE-WETTING

TSV Structure and Method Forming Same

Heterogeneous Dielectric Bonding Scheme

Bonding Structures of Integrated Circuit Devices and Method Forming...

APPARATUS AND METHOD FOR WAFER PRE-WETTING

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

TSV Structure and Method Forming Same

Isolation Bonding Film for Semiconductor Packages and Methods of Fo...

Method of Forming Semiconductor Device Having Backside Interconnect...

Through-Substrate Vias with Improved Connections

Interconnect Structure and Method of Forming Same

Isolation Bonding Film for Semiconductor Packages and Methods of Fo...

Profile of Through Via Protrusion in 3DIC Interconnect