Kuan-Chou Lin

Follow

Person

Tainan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding pad and chip structure
- Patent number 7,064,449
- Issue date Jun 20, 2006
- Himax Technologies, Inc.
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD AND CHIP STRUCTURE
- Publication number 20060006531
- Publication date Jan 12, 2006
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS