Kuan-Hsiung Wang

Person

Miao-Li County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,125,876
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having lid with protrusion and manufacturing meth...
- Patent number 12,094,792
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation regions including two layers and method forming same
- Patent number 12,051,614
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 12,002,714
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 11,488,899
- Issue date Nov 1, 2022
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 11,450,569
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,199,736
- Issue date Dec 14, 2021
- Innolux Corporation
- Kuan-Jen Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,075,155
- Issue date Jul 27, 2021
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation regions including two layers and method forming same
- Patent number 11,031,280
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings and methods forming same
- Patent number 10,978,341
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings and methods forming same
- Patent number 10,510,593
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 10,490,493
- Issue date Nov 26, 2019
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bi-layer STI deposition
- Patent number 9,960,074
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings and methods forming same
- Patent number 9,881,834
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical filtering for integrated dielectrics UV curing processes
- Patent number 9,837,267
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flowable films and methods of forming flowable films
- Patent number 9,728,402
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface passivation for germanium-based semiconductor structure
- Patent number 9,647,090
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display and electronic device
- Patent number 9,223,144
- Issue date Dec 29, 2015
- Innolux Corporation
- Jhen-Wei He
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low-k Cu barriers in damascene interconnect structures
- Patent number 8,993,435
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display, electronic device and display method of display
- Patent number 8,848,116
- Issue date Sep 30, 2014
- Innolux Corporation
- Jhen-Wei He
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Double patterning strategy for contact hole and trench in photolith...
- Patent number 8,470,708
- Issue date Jun 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extreme low-K dielectric film scheme for advanced interconnects
- Patent number RE42514
- Issue date Jul 5, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Wen Tsai
- 257 - Active solid-state devices
Information Patent Grant
Extreme low-k dielectric film scheme for advanced interconnect
- Patent number 7,626,245
- Issue date Dec 1, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Wen Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of making CMOS device structure having an anti-SCE block im...
- Patent number 6,232,164
- Issue date May 15, 2001
- Taiwan Semiconductor Manufacturing Company
- Chaochieh Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE
- Publication number 20250221310
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...
- Publication number 20250218986
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH THROUGH VIA
- Publication number 20250167077
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Multiple TSVs with Different Formation Schemes
- Publication number 20250157889
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE-VIA CELL
- Publication number 20250118655
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Sheng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250069990
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Hsin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20250070052
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371715
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF
- Publication number 20240290659
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR LINER FOR THROUGH SUBSTRATE VIA
- Publication number 20240282837
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230065147
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20230027220
- Publication date Jan 26, 2023
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF
- Publication number 20220384267
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF
- Publication number 20220093468
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Regions Including Two Layers and Method Forming Same
- Publication number 20210296160
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20200357732
- Publication date Nov 12, 2020
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Openings and Methods Forming Same
- Publication number 20200111705
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200051902
- Publication date Feb 13, 2020
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMI...
- Publication number 20190381630
- Publication date Dec 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Cheng Wang
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190361285
- Publication date Nov 28, 2019
- InnoLux Corporation
- Kuan-Jen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190035715
- Publication date Jan 31, 2019
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Bi-Layer STI Deposition
- Publication number 20180226291
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180190579
- Publication date Jul 5, 2018
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Hsiung Wang

Person

Patents Grantslast 30 patents

Package device

Semiconductor device and method

Package structure having lid with protrusion and manufacturing meth...

Isolation regions including two layers and method forming same

Semiconductor device and forming method thereof

Package device

Semiconductor device and forming method thereof

Electronic device

Package structure and manufacturing method thereof

Isolation regions including two layers and method forming same

Contact openings and methods forming same

Contact openings and methods forming same

Package structure and manufacturing method thereof

Integrated bi-layer STI deposition

Contact openings and methods forming same

Optical filtering for integrated dielectrics UV curing processes

Flowable films and methods of forming flowable films

Surface passivation for germanium-based semiconductor structure

Display and electronic device

Low-k Cu barriers in damascene interconnect structures

Display, electronic device and display method of display

Double patterning strategy for contact hole and trench in photolith...

Extreme low-K dielectric film scheme for advanced interconnects

Extreme low-k dielectric film scheme for advanced interconnect

Process of making CMOS device structure having an anti-SCE block im...

Patents Applicationslast 30 patents

Through Via Power Delivery Structure for Stacked Chips

ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

METHOD FOR FORMING DEVICE SUBSTRATE, METHOD FOR FORMING PACKAGE STR...

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

SEMICONDUCTOR STRUCTURES WITH THROUGH VIA

MANUFACTURING METHOD OF PACKAGE DEVICE

Forming Multiple TSVs with Different Formation Schemes

THROUGH-SUBSTRATE-VIA CELL

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE WITH SEAL RING STRUCTURE AND METHOD FOR FORMIN...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

AIR LINER FOR THROUGH SUBSTRATE VIA

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE DEVICE

SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

Isolation Regions Including Two Layers and Method Forming Same

PACKAGE DEVICE

Contact Openings and Methods Forming Same

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

POLISHING PAD, POLISHING APPARATUS AND METHOD OF MANUFACTURING SEMI...

ELECTRONIC DEVICE

PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF

Integrated Bi-Layer STI Deposition

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF