Kuan-I Cheng

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,455,159
- Issue date Sep 27, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20160013074
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS