Kuan-Jui Huang

Person

Kao-Hsiung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode package and method of making the same
- Patent number 8,129,206
- Issue date Mar 6, 2012
- Touch Micro-System Technology Corp.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for connecting plurality of chips and method for manufac...
- Patent number 7,987,588
- Issue date Aug 2, 2011
- Touch Micro-System Technology Inc.
- Kuan-Jui Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of fabricating metal interconnects and inter-metal dielectri...
- Patent number 7,795,131
- Issue date Sep 14, 2010
- Touch Micro-System Technology Inc.
- Kuan-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making light emitting diode chip package
- Patent number 7,732,233
- Issue date Jun 8, 2010
- Touch Micro-System Technology Corp.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wear-resistant dielectric layer
- Patent number 7,262,078
- Issue date Aug 28, 2007
- Touch Micro-System Technology Inc.
- Wei-Shun Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20120080693
- Publication date Apr 5, 2012
- TOUCH MICRO-SYSTEM TECHNOLOGY CORPORATION
- Hung-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20100090245
- Publication date Apr 15, 2010
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20090273004
- Publication date Nov 5, 2009
- Hung-Yi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE CHIP PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20090267108
- Publication date Oct 29, 2009
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFAC...
- Publication number 20090064496
- Publication date Mar 12, 2009
- Kuan-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MICRO MECHANICAL MOVING MEMBER AND METAL INTE...
- Publication number 20080188024
- Publication date Aug 7, 2008
- Kuan-Jui Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFAC...
- Publication number 20080182432
- Publication date Jul 31, 2008
- Kuan-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING METAL INTERCONNECTS AND INTER-METAL DIELECTRI...
- Publication number 20080146021
- Publication date Jun 19, 2008
- Kuan-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME
- Publication number 20060263934
- Publication date Nov 23, 2006
- Shu-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME
- Publication number 20060186523
- Publication date Aug 24, 2006
- Shu-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A WEAR-RESISTANT DIELECTRIC LAYER
- Publication number 20060183259
- Publication date Aug 17, 2006
- Wei-Shun Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER
- Publication number 20060183312
- Publication date Aug 17, 2006
- Shu-Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Jui Huang

Person

Patents Grantslast 30 patents

Light emitting diode package and method of making the same

Interposer for connecting plurality of chips and method for manufac...

Method of fabricating metal interconnects and inter-metal dielectri...

Method for making light emitting diode chip package

Method of forming a wear-resistant dielectric layer

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME

LIGHT EMITTING DIODE PACKAGE AND METHOD OF MAKING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

LIGHT EMITTING DIODE CHIP PACKAGE AND METHOD OF MAKING THE SAME

INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFAC...

METHOD OF FABRICATING MICRO MECHANICAL MOVING MEMBER AND METAL INTE...

INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFAC...

METHOD OF FABRICATING METAL INTERCONNECTS AND INTER-METAL DIELECTRI...

CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME

CHIP-TYPE MICRO-CONNECTOR AND METHOD OF PACKAGING THE SAME

METHOD OF FORMING A WEAR-RESISTANT DIELECTRIC LAYER

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER