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Kuan Luen Chen
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San Jose, CA, US
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last 30 patents
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Patent Grant
Thermally-enhanced lead frame with reduced thermal gap
Patent number
5,914,528
Issue date
Jun 22, 1999
National Semiconductor Corporation
Hem P. Takiar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Single-core two-side substrate with u-strip and co-planar signal tr...
Patent number
5,825,084
Issue date
Oct 20, 1998
Express Packaging Systems, Inc.
John H. Lau
H01 - BASIC ELECTRIC ELEMENTS