Kuan-Neng Chen

Person

White Plains, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,617,689
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Programmable via devices
- Patent number 8,525,144
- Issue date Sep 3, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuits and techniques for fabricatio...
- Patent number 8,426,921
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via devices
- Patent number 8,389,967
- Issue date Mar 5, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via devices in back end of line level
- Patent number 8,243,507
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Kuan-Neng Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,241,995
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming tubular objects
- Patent number 8,168,542
- Issue date May 1, 2012
- International Business Machines Corporation
- Kuan-Neng Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Techniques for three-dimensional circuit integration
- Patent number 8,129,811
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four-terminal reconfigurable devices
- Patent number 8,053,752
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming features in integrated circuits
- Patent number 8,012,811
- Issue date Sep 6, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
CMOS-process-compatible programmable via device
- Patent number 7,982,203
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Programmable via devices with air gap isolation
- Patent number 7,977,203
- Issue date Jul 12, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via devices in back end of line level
- Patent number 7,969,770
- Issue date Jun 28, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Techniques for three-dimensional circuit integration
- Patent number 7,955,887
- Issue date Jun 7, 2011
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuits and techniques for fabricatio...
- Patent number 7,897,428
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via structure and method of fabricating same
- Patent number 7,888,164
- Issue date Feb 15, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four-terminal reconfigurable devices
- Patent number 7,880,157
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS-process-compatible programmable via device
- Patent number 7,811,933
- Issue date Oct 12, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Hermetic seal and reliable bonding structures for 3D applications
- Patent number 7,786,596
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four-terminal reconfigurable devices
- Patent number 7,772,582
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS-process-compatible programmable via device
- Patent number 7,687,309
- Issue date Mar 30, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Hermetic seal and reliable bonding structures for 3D applications
- Patent number 7,683,478
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via devices with air gap isolation
- Patent number 7,659,534
- Issue date Feb 9, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable via structure and method of fabricating same
- Patent number 7,652,278
- Issue date Jan 26, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch array circuit and system using programmable via structures w...
- Patent number 7,608,851
- Issue date Oct 27, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Four-terminal programmable via-containing structure and method of f...
- Patent number 7,579,616
- Issue date Aug 25, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20130307139
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Programmable Via Devices in Back End of Line Level
- Publication number 20110217836
- Publication date Sep 8, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Three-Dimensional Circuit Integration
- Publication number 20110193169
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuits and Techniques for Fabricatio...
- Publication number 20110133281
- Publication date Jun 9, 2011
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Four-Terminal Reconfigurable Devices
- Publication number 20110102016
- Publication date May 5, 2011
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20100255262
- Publication date Oct 7, 2010
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CMOS-Process-Compatible Programmable Via Device
- Publication number 20100133502
- Publication date Jun 3, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- G11 - INFORMATION STORAGE
Information Patent Application
CMOS-Process-Compatible Programmable Via Device
- Publication number 20100127732
- Publication date May 27, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- G11 - INFORMATION STORAGE
Information Patent Application
Four-Terminal Reconfigurable Devices
- Publication number 20100038621
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE VIA STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20090311858
- Publication date Dec 17, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH ARRAY CIRCUIT AND SYSTEM USING PROGRAMMABLE VIA STRUCTURES W...
- Publication number 20090303786
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Programmable Via Devices with Air Gap Isolation
- Publication number 20090305460
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuits and Techniques for Fabricatio...
- Publication number 20090294814
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Three-Dimensional Circuit Integration
- Publication number 20090297091
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Via Devices
- Publication number 20090291546
- Publication date Nov 26, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Features in Integrated Circuits
- Publication number 20090176062
- Publication date Jul 9, 2009
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Tubular Objects
- Publication number 20090176040
- Publication date Jul 9, 2009
- Kuan-Neng Chen
- B82 - NANO-TECHNOLOGY
Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20090140404
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Programmable Via Devices
- Publication number 20090111263
- Publication date Apr 30, 2009
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable Via Devices
- Publication number 20090101882
- Publication date Apr 23, 2009
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE VIA DEVICES IN BACK END OF LINE LEVEL
- Publication number 20090033358
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE VIA DEVICES WITH AIR GAP ISOLATION
- Publication number 20090033360
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Four-Terminal Reconfigurable Devices
- Publication number 20090014885
- Publication date Jan 15, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS-PROCESS-COMPATIBLE PROGRAMMABLE VIA DEVICE
- Publication number 20090003045
- Publication date Jan 1, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- G11 - INFORMATION STORAGE
Information Patent Application
SWITCH ARRAY CIRCUIT AND SYSTEM USING PROGRAMMABLE VIA STRUCTURES W...
- Publication number 20080277644
- Publication date Nov 13, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20080268574
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOUR-TERMINAL PROGRAMMABLE VIA-CONTAINING STRUCTURE AND METHOD OF F...
- Publication number 20080251778
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20080142958
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMABLE VIA STRUCTURE AND METHOD OF FABRICATING SAME
- Publication number 20080142775
- Publication date Jun 19, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20080124835
- Publication date May 29, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Neng Chen

Person

Patents Grantslast 30 patents

Bonding of substrates including metal-dielectric patterns with meta...

Programmable via devices

Three-dimensional integrated circuits and techniques for fabricatio...

Programmable via devices

Programmable via devices in back end of line level

Bonding of substrates including metal-dielectric patterns with meta...

Methods of forming tubular objects

Techniques for three-dimensional circuit integration

Four-terminal reconfigurable devices

Methods of forming features in integrated circuits

CMOS-process-compatible programmable via device

Programmable via devices with air gap isolation

Programmable via devices in back end of line level

Techniques for three-dimensional circuit integration

Three-dimensional integrated circuits and techniques for fabricatio...

Programmable via structure and method of fabricating same

Four-terminal reconfigurable devices

CMOS-process-compatible programmable via device

Hermetic seal and reliable bonding structures for 3D applications

Four-terminal reconfigurable devices

CMOS-process-compatible programmable via device

Hermetic seal and reliable bonding structures for 3D applications

Programmable via devices with air gap isolation

Programmable via structure and method of fabricating same

Switch array circuit and system using programmable via structures w...

Four-terminal programmable via-containing structure and method of f...

Patents Applicationslast 30 patents

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

Programmable Via Devices in Back End of Line Level

Techniques for Three-Dimensional Circuit Integration

Three-Dimensional Integrated Circuits and Techniques for Fabricatio...

Four-Terminal Reconfigurable Devices

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

CMOS-Process-Compatible Programmable Via Device

CMOS-Process-Compatible Programmable Via Device

Four-Terminal Reconfigurable Devices

PROGRAMMABLE VIA STRUCTURE AND METHOD OF FABRICATING SAME

SWITCH ARRAY CIRCUIT AND SYSTEM USING PROGRAMMABLE VIA STRUCTURES W...

Programmable Via Devices with Air Gap Isolation

Three-Dimensional Integrated Circuits and Techniques for Fabricatio...

Techniques for Three-Dimensional Circuit Integration

Programmable Via Devices

Methods of Forming Features in Integrated Circuits

Methods of Forming Tubular Objects

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

Method of Forming Programmable Via Devices

Programmable Via Devices

PROGRAMMABLE VIA DEVICES IN BACK END OF LINE LEVEL

PROGRAMMABLE VIA DEVICES WITH AIR GAP ISOLATION

Four-Terminal Reconfigurable Devices

CMOS-PROCESS-COMPATIBLE PROGRAMMABLE VIA DEVICE

SWITCH ARRAY CIRCUIT AND SYSTEM USING PROGRAMMABLE VIA STRUCTURES W...

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

FOUR-TERMINAL PROGRAMMABLE VIA-CONTAINING STRUCTURE AND METHOD OF F...

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

PROGRAMMABLE VIA STRUCTURE AND METHOD OF FABRICATING SAME

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS