Kuan-Ting Lai

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Edge device and method for detecting specific object based on speci...
- Patent number 11,983,942
- Issue date May 14, 2024
- Himax Technologies Limited
- Ti-Wen Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device structure with protected bump and method of fo...
- Patent number 11,171,100
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 11,004,741
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 10,566,237
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 10,163,705
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EDGE DEVICE AND METHOD FOR DETECTING SPECIFIC OBJECT BASED ON SPECI...
- Publication number 20220414363
- Publication date Dec 29, 2022
- HIMAX TECHNOLOGIES LIMITED
- Ti-Wen Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...
- Publication number 20210159197
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20200144119
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20190122927
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Profile of Through Via Protrusion in 3DIC Interconnect
- Publication number 20150311141
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW TARGET ASSEMBLY
- Publication number 20120037500
- Publication date Feb 16, 2012
- SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
- Chung-Han WU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Kuan-Ting Lai

Person

Patents Grantslast 30 patents

Edge device and method for detecting specific object based on speci...

Semiconductor device structure with protected bump and method of fo...

Profile of through via protrusion in 3DIC interconnect

Profile of through via protrusion in 3DIC interconnect

Profile of through via protrusion in 3DIC interconnect

Patents Applicationslast 30 patents

EDGE DEVICE AND METHOD FOR DETECTING SPECIFIC OBJECT BASED ON SPECI...

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...

Profile of Through Via Protrusion in 3DIC Interconnect

Profile of Through Via Protrusion in 3DIC Interconnect

Profile of Through Via Protrusion in 3DIC Interconnect

HOLLOW TARGET ASSEMBLY