Kuan-Wei Chuang

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor package having an interposer st...
- Patent number 9,548,220
- Issue date Jan 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and interposer structure of the semiconducto...
- Patent number 9,257,381
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 8,895,367
- Issue date Nov 25, 2014
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,519,526
- Issue date Aug 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240258121
- Publication date Aug 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER ST...
- Publication number 20160118271
- Publication date Apr 28, 2016
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, CARRIER STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20160079110
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20140127864
- Publication date May 8, 2014
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140077387
- Publication date Mar 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SEMICONDUCTOR PACK...
- Publication number 20140070424
- Publication date Mar 13, 2014
- Siliconware Precision Industries Co., Ltd.
- Kuan-Wei Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20130330883
- Publication date Dec 12, 2013
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120161301
- Publication date Jun 28, 2012
- Siliconware Precision Industries Co., Ltd.
- Jung-Pang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Kuan-Wei Chuang

Person

Patents Grantslast 30 patents

Method of fabricating semiconductor package having an interposer st...

Semiconductor package, and interposer structure of the semiconducto...

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER ST...

SEMICONDUCTOR PACKAGE, CARRIER STRUCTURE AND FABRICATION METHOD THE...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SEMICONDUCTOR PACK...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF