Kuang-Chun Lee

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture
- Patent number 11,978,720
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,855,009
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,764,118
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring structure and method for forming t...
- Patent number 11,728,233
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with warpage release layer structure in package a...
- Patent number 11,694,974
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device package
- Patent number 11,508,710
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,410,939
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with lid
- Patent number 10,797,006
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 10,790,164
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semicondcutor device package
- Patent number 10,714,463
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semicondcutor device package
- Patent number 10,504,880
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of forming semiconductor de...
- Patent number 10,276,551
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with lid
- Patent number 10,163,816
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with thermal dissipation structure and method for form...
- Patent number 9,870,975
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly, semiconductor package and forming m...
- Patent number 9,748,156
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and manufacturing method thereof
- Patent number 9,653,391
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20240258266
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20240120294
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240071854
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240071950
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230411307
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy through vias for Integrated Circuit Packages and Methods of F...
- Publication number 20230377905
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20230369149
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE A...
- Publication number 20230275038
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-LIQUID COMPOSITE COOLER FOR MEMORY MODULE
- Publication number 20230229208
- Publication date Jul 20, 2023
- TAIWAN MICROLOOPS CORP.
- Chun-Hung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE A...
- Publication number 20230010707
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR SEMICONDUCTOR PACKAGE MOUNTING WITH IMPROVED CO-PLANARI...
- Publication number 20220415773
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING STRUCTURE
- Publication number 20220384391
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220352045
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20220336377
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20220238480
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING T...
- Publication number 20210217676
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH LID
- Publication number 20210013160
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE
- Publication number 20200286878
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE
- Publication number 20200098739
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE
- Publication number 20190252363
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID
- Publication number 20190096826
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DE...
- Publication number 20190006341
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORM...
- Publication number 20180019183
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID
- Publication number 20170358542
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS

Kuang-Chun Lee

Person

Patents Grantslast 30 patents

Package structure with protective lid

Semiconductor device package and methods of manufacture

Chip package with lid

Structure and formation method of chip package with protective lid

Chip package structure with ring structure and method for forming t...

Semiconductor die with warpage release layer structure in package a...

Method of forming semiconductor device package

Chip package with lid

Structure and formation method of chip package with lid

Method for forming package structure

Method of forming semicondcutor device package

Method of forming semicondcutor device package

Semiconductor device package and method of forming semiconductor de...

Structure and formation method of chip package with lid

Chip package with thermal dissipation structure and method for form...

Semiconductor package assembly, semiconductor package and forming m...

Semiconductor packaging structure and manufacturing method thereof

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH PROTECTIVE LID

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

CHIP PACKAGE WITH LID

MULTI-DIE PACKAGE AND METHODS OF FORMATION

Integrated Circuit Packages and Methods of Forming the Same

Semiconductor Device and Method Forming Same

Semiconductor Device and Method Forming Same

Dummy through vias for Integrated Circuit Packages and Methods of F...

PACKAGE STRUCTURE WITH PROTECTIVE LID

SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE A...

AIR-LIQUID COMPOSITE COOLER FOR MEMORY MODULE

SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE A...

SYSTEMS FOR SEMICONDUCTOR PACKAGE MOUNTING WITH IMPROVED CO-PLANARI...

CHIP PACKAGE STRUCTURE WITH RING STRUCTURE

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

CHIP PACKAGE WITH LID

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

CHIP PACKAGE STRUCTURE WITH RING STRUCTURE AND METHOD FOR FORMING T...

CHIP PACKAGE WITH LID

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID

SEMICONDCUTOR DEVICE PACKAGE AND METHOD OF FORMING SEMICONDCUTOR DE...

CHIP PACKAGE WITH THERMAL DISSIPATION STRUCTURE AND METHOD FOR FORM...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH LID