Kuang-Hua Wang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Testing apparatus and method of using the same
- Patent number 12,066,457
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method of manufacturing the same
- Patent number 11,778,727
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing apparatus and method of using the same
- Patent number 11,693,025
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TESTING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240345130
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230363080
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230280370
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- G01 - MEASURING TESTING
Information Patent Application
TESTING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230067209
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230066017
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS