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Kuang-Hui Tang

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  • Fongshan City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SILICON VIAS AND METH...
    • Publication number 20230230930
    • Publication date Jul 20, 2023
    • UNITED MICROELECTRONICS CORP.
    • Kuang-Hui Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING CRACK-STOPPING STRUCTURES
    • Publication number 20160336274
    • Publication date Nov 17, 2016
    • UNITED MICROELECTRONICS CORP.
    • Kuang-Hui Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CRACK-STOPPING STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20150270228
    • Publication date Sep 24, 2015
    • UNITED MICROELECTRONICS CORP.
    • Kuang-Hui Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20150255430
    • Publication date Sep 10, 2015
    • UNITED MICROELECTRONICS CORP.
    • Kuang-Hui Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SCRIBE LINE STRUCTURE
    • Publication number 20150214125
    • Publication date Jul 30, 2015
    • UNITED MICROELECTRONICS CORP.
    • Kuang-Hui Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR GENERATING DIE IDENTIFICATION BY MEASURING WHETHER CIRCU...
    • Publication number 20150155209
    • Publication date Jun 4, 2015
    • UNITED MICROELECTRONICS CORP.
    • Kuang-Hui Tang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE AND PROCESS THEREOF
    • Publication number 20090218679
    • Publication date Sep 3, 2009
    • United Microelectronics Corp.
    • MIN-CHIH HSUAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING PAD STRUCTURE
    • Publication number 20080303177
    • Publication date Dec 11, 2008
    • United Microelectronics Corp.
    • Ping-Chang Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE AND PROCESS THEREOF
    • Publication number 20080185710
    • Publication date Aug 7, 2008
    • United Microelectronics Corp.
    • MIN-CHIH HSUAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGING PROCESS
    • Publication number 20070085206
    • Publication date Apr 19, 2007
    • United Microelectronics Corp.
    • MIN-CHIH HSUAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip package and process thereof
    • Publication number 20050212132
    • Publication date Sep 29, 2005
    • Min-Chih Hsuan
    • H01 - BASIC ELECTRIC ELEMENTS