KUANG-LIN LO

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KAOSHIUNG HSIEN, TW

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Patents Grantslast 30 patents

Information Patent Grant
Stacked structure of semiconductor package
- Patent number 6,163,076
- Issue date Dec 19, 2000
- Advanced Semiconductor Engineering, Inc.
- Chun-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip assembly utilizing a lead frame
- Patent number 6,118,176
- Issue date Sep 12, 2000
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a heat spreader capable of preventing...
- Patent number 6,093,960
- Issue date Jul 25, 2000
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE METHOD
- Publication number 20070087480
- Publication date Apr 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Su TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME]
- Publication number 20040124515
- Publication date Jul 1, 2004
- SU TAO
- H01 - BASIC ELECTRIC ELEMENTS