Kuang-Neng Chen

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and fabrication method thereof
- Patent number 10,249,562
- Issue date Apr 2, 2019
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electronic package
- Patent number 10,199,320
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof and substrate str...
- Patent number 10,049,973
- Issue date Aug 14, 2018
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 9,818,683
- Issue date Nov 14, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,748,183
- Issue date Aug 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,627,307
- Issue date Apr 18, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and method of manufacturing the same
- Patent number 9,196,596
- Issue date Nov 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure for package and fabrication method thereof
- Patent number 9,076,796
- Issue date Jul 7, 2015
- Siliconware Precision Industries Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulb lamp
- Patent number D689216
- Issue date Sep 3, 2013
- Dongguan Masstop Liquid Crystal Display Co., Ltd.
- Yu-Liang Chow
- D26 - Lighting
Information Patent Grant
Wafer treating method for making adhesive dies
- Patent number RE42349
- Issue date May 10, 2011
- ChipMOS Technologies (Bermuda)
- Chun-Hung Lin
- 427 - Coating processes

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING ELECTRONIC PACKAGE
- Publication number 20180040550
- Publication date Feb 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170186703
- Publication date Jun 29, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170148716
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170040248
- Publication date Feb 9, 2017
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE STR...
- Publication number 20160276256
- Publication date Sep 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160148873
- Publication date May 26, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160133556
- Publication date May 12, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160086903
- Publication date Mar 24, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160066427
- Publication date Mar 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF
- Publication number 20160049359
- Publication date Feb 18, 2016
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140367849
- Publication date Dec 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Ching-Wen Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SPEAKERPHONE AND MICROPHONE
- Publication number 20140321672
- Publication date Oct 30, 2014
- WINTEK CORPORATION
- Chia-Hung Yeh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140217605
- Publication date Aug 7, 2014
- Siliconware Precision Industries Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20140117538
- Publication date May 1, 2014
- Siliconware Precision Industries Co., Ltd.
- Kuang-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS

Kuang-Neng Chen

Person

Patents Grantslast 30 patents

Package structure and fabrication method thereof

Method of fabricating electronic package

Electronic package and fabrication method thereof and substrate str...

Electronic package and method of fabricating the same

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Interposer and method of manufacturing the same

Interconnection structure for package and fabrication method thereof

Bulb lamp

Wafer treating method for making adhesive dies

Patents Applicationslast 30 patents

METHOD OF FABRICATING ELECTRONIC PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE STR...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

INTERPOSER WITH CONDUCTIVE POST AND FABRICATION METHOD THEREOF

INTERPOSER AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE WITH SPEAKERPHONE AND MICROPHONE

INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF