Kuang-Wei Huang

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure having micro-electro-mechanical system element an...
- Patent number 8,878,356
- Issue date Nov 4, 2014
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEM ELEMENT AN...
- Publication number 20130341739
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20130320463
- Publication date Dec 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY