Kuei-Chen Liang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Substrate for semiconductor package
- Patent number 6,933,600
- Issue date Aug 23, 2005
- Silicon Integrated Systems Corp.
- Chung-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bonding device and manufacturing method thereof
- Patent number 6,765,301
- Issue date Jul 20, 2004
- Silicon Integrated Systems Corp.
- Chung-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package capable of improving signal quality
- Patent number 6,744,128
- Issue date Jun 1, 2004
- Silicon Integrated Systems Corp.
- Chung-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an EPROM
- Patent number 5,576,234
- Issue date Nov 19, 1996
- Hualon Microelectronics Corporation
- Kuei-Chang Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Structure and assembly method of integrated circuit package
- Publication number 20060226534
- Publication date Oct 12, 2006
- Silicon Integrated Systems Corp.
- Kuei-Chen Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate for semiconductor package
- Publication number 20030160294
- Publication date Aug 28, 2003
- Chung Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package capable of improving signal quality
- Publication number 20030122238
- Publication date Jul 3, 2003
- Chung-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit bonding device and manufacturing method thereof
- Publication number 20030094703
- Publication date May 22, 2003
- Chung-Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device
- Publication number 20030067048
- Publication date Apr 10, 2003
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS